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I-Connect007 is excited to announce the release of the latest title in our micro eBook design series: The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
The Printed Circuit Designer’s Guide to… is an ongoing book series specifically dedicated to educating PCB designers, and serves as a valuable resource for people seeking the most relevant design information available.
Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
The authors provide essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates. The book also aims to aid PCB designers in the selection and specification of materials for particular applications, which will contribute to more reliable and cost-effective designs.
Alun Morgan, Chairman at EIPC, describes the book as, "A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Readers will develop a comprehensive awareness of the physical realities of insulated metal substrates and their applications in the thermal management of electronic assemblies.
Look for these other exciting titles in The Printed Circuit Designer’s Guide to… series:
- Fundamentals of RF/Microwave PCBs and Flex and Rigid-Flex Fundamentals by American Standard Circuits
- Power Integrity and Signal Integrity by Example by Mentor, A Siemens Business
- Secrets of High-Speed PCBs — Parts 1 & 2 by Polar Instruments
- Design for Manufacturing (DFM) by Altium
…and these upcoming releases:
- Executing Complex PCBs by Freedom CAD
- Documentation by DownStream Technologies
We hope you enjoy The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates.
For more information, contact: