Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018


Reading time ( words)

Thermal management and signal integrity will be the focus for Ventec International Group at this year’s IPC APEX EXPO show in San Diego (27th February – 1st March). On booth #818 the Ventec team will be on hand to demonstrate unique laminate & prepreg capability across a very wide range of applications and budgets. Show-highlights will feature the latest products from Ventec’s tec-thermal and tec-speed ranges as well as the launch of the much-anticipated micro eBook "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates".

Ventec is further strengthening its position as a global leader in technology for high performance thermal management and signal integrity materials at the San Diego Convention Center on booth #818. Show-highlights include:

APEX EXPO debut: VT-5A2 Highest Performance Thermally Conductive Laminate Material

Ventec’s highest performance thermally conductive laminate material so far will make its APEX EXPO debut: VT-5A2 offers a polymer matrix that is fully compatible with Ventec laminates, epoxy or polyimide-based materials including tec-speed, making it the ideal choice for the manufacture of hybrid multilayer low-loss constructions. VT-5A2 sets itself apart by offering highest performance thermal conductivity 8 times that of FR4 at 2.2 W/m.K, a high Tg of 190°C, best in class thermal performance (T260 >60 Minutes, T288 >30 Minutes and T300 >15 Minutes) and MOT of 150°C. VT-5A2 is lead-free assembly compatible, fulfils RoHS and WEEE requirements and complies with UL94 V0.

tec-speed High-Speed/Low-Loss Materials  

The tec speed brand unites one of the most comprehensive range of products in high speed/low loss PCB material technology. By using an ultra-low Dk material with Dk values between 2.3 and 2.8 lower losses, lower system power requirements and with it, the delicate balance of performance and cost can be achieved. Higher layer counts on backplanes, daughter cards and hand-held's are made possible in a smaller footprint by having smaller layer-to-layer separation without sacrificing trace width. Every tec speed product provides technological innovation, high performance and quality to customers to perfectly meet their needs.

Presenting Space and Aerospace PCB Material Capability

Ventec manufactures its polyimide and thin-core laminates using specially designed treaters with multiple stage filtration systems and 100% automated optical inspection (AOI) for prepreg FOD-control. Most recently Ventec was the first and only laminator to receive IPC-4101 Qualified Products Listing. The IPC's Validation Services program qualified VT-90H and VT-901 to specification sheet 41 of IPC-4101E (Specification for Base Materials for Rigid and Multilayer Printed Boards), putting Ventec in a market-leading position within the military, space and aerospace electronics supply chain.

VT-90H (UL-94 HB) and VT-901 (UL-94 V0) are exceptional material solutions for high reliability ML rigid and flex-rigid PCBs for use in thermally challenging environments, with high Td (VT-901=395, VT-90H=408), a Tg of 250oC and Low-Axis CTE (50). Both polyimide materials provide the extremely high reliability performance particularly demanded by military and aerospace as well as downhole drilling and similarly challenging applications.

Micro e-book promotion: "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates"

Launched in time for IPC APEX EXPO, "The Printed Circuit Designer's Guide to... Thermal Management with Insulated Metal Substrates," by Ventec’s Didier Mauve and Ian Mayoh in collaboration with I Connect007, provides the PCB designer with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate (IMS) laminates, in order to select and specify the most appropriate material for a particular thermal management application, and to achieve a reliable and cost-effective design. A download link will be provided to booth-visitors for a free e-copy of the guide.

All these and more can be seen at the Ventec APEX EXPO booth #818. 

About Ventec International

With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the US and Europe, Ventec International is a premier supplier to the Global PCB industry. For more information, click here.

Share




Suggested Items

Plating on Silver: What’s Old is New Again

07/07/2022 | Denis Jacques, Technic Inc.
About three decades ago, immersion silver, a nitrate-based process, gained a lot of market share in the world of PCB final finishes. More economical than ENIG, flat, solderable, and conductive, it had everything going for it—everything but corrosion resistance in a harsh environment, that is. Champagne voids were also an issue, along with line reduction. But the worst drawback, the characteristic that made the part short over time, was creep corrosion. A build-up of copper sulfide salt that grows in contact with a sulfur-rich environment, heat, and moisture resulted in failures in the field. This was enough to scar the process for good.

EIPC Summer Conference 2022: Day 2 Review

06/29/2022 | Pete Starkey, I-Connect007
Örebro, Sweden on June 15 brought a bright and early start to Day 2 of the EIPC Summer Conference for those who had enjoyed the previous evening’s networking dinner, but had resisted the temptation to over-indulge or to carry on their long-awaited catch-up conversations with old friends into the small hours. All but a few were in their seats for 9 a.m., awake and attentive for Session 4 of the conference, on the theme of new process technologies, moderated by Martyn Gaudion, CEO of Polar Instruments.

EIPC Summer Conference 2022: Day 1 Review

06/28/2022 | Pete Starkey, I-Connect007
At last, a live EIPC conference and this time in the Swedish city of Örebro, “where history and contemporary culture converge,” a pleasant and convenient location for an event that included a privileged visit to the Ericsson facility in Kumla. Around 100 delegates made the journey and the Örebro Scandic Grand Hotel was an excellent conference venue for the June 14-15 conference.



Copyright © 2022 I-Connect007. All rights reserved.