Free eBook Series for PCB Designers


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I-Connect007 is proud to continue expanding its micro eBook design series: The Printed Circuit Designer’s Guide to… This ongoing series of eBooks is specifically dedicated to educating PCB designers and enhancing their knowledge. It serves as a valuable resource for people seeking the most relevant design information available. 

Each eBook is peer reviewed by industry experts to ensure technical accuracy. Published titles cover a variety of such topics as signal and power integrity, high-speed PCBs, RF/microwave PCBs, flex and rigid-flex PCBs, and design for manufacturing (DFM). Upcoming releases include thermal management with insulated metal substrates, designing complex PCBs, and documentation.

Looking for a reliable source on essential and innovative PCB design topics? Download The Printed Circuit Designer’s Guide to… eBook series from I-Connect007. Find the latest titles and view our full library at www.I-007eBooks.com.

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Suggested Items

DownStream Flexes in Rigid-Flex

11/14/2022 | Andy Shaughnessy, Design007 Magazine
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.

Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book

10/27/2022 | Nolan Johnson, I-Connect007
There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.

Forming Standards for Ultra HDI

10/25/2022 | Andy Shaughnessy, Design007 Magazine
To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.



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