Reading time ( words)
There’s a lot of talk about the 3rd generation of Double Data Rate memory known as DDR3. We at Nine Dot Connects have laid out several DDR3 boards in the past three months. There is quite a bit of detail to know about DDR3 design and layout and unfortunately, there is also a lot of misinformation out there. We have waded though and analyzed the literature. We wish to share our findings and understanding with you in our latest webinar series, Double Data Rate (DDR3) Shouldn't be Double Trouble.
In our two-part series on this topic, we will first cover key concepts necessary for proper signal integrity and general DDR3 design. Topics to be covered this month are:
- Brief history of the DDR concept
- Comparison between the different generations of DDR
- The signaling and timing requirements for DDR3
- Understanding match length versus match delay
- Compensating for typical routing delay
- Using the iCD Stackup Planner to assist in delay matching calculation
In part 2, we will build upon this foundation by demonstrating the practical aspects of DDR3 layout techniques.
This latest webinar, Double Data Rate (DDR3) Shouldn't be Double Trouble, is scheduled for January 31, 2018 at 2 pm Eastern Time. For more information and to register, click HERE.
Bill Acito, Cadence Design Systems
The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.
Dave Wiens, Mentor, a Siemens Business
PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.
Andy Shaughnessy, Design007 Magazine
Millennials are the future of our industry. What does this mean for the PCB design community? How do we attract more of these smart young people to the world of PCB design? I asked Paul Musto, director of marketing for Mentor’s Board Systems Division, to explain the company’s initiatives aimed at drawing more young people into PCB design