Reading time ( words)
There’s a lot of talk about the 3rd generation of Double Data Rate memory known as DDR3. We at Nine Dot Connects have laid out several DDR3 boards in the past three months. There is quite a bit of detail to know about DDR3 design and layout and unfortunately, there is also a lot of misinformation out there. We have waded though and analyzed the literature. We wish to share our findings and understanding with you in our latest webinar series, Double Data Rate (DDR3) Shouldn't be Double Trouble.
In our two-part series on this topic, we will first cover key concepts necessary for proper signal integrity and general DDR3 design. Topics to be covered this month are:
- Brief history of the DDR concept
- Comparison between the different generations of DDR
- The signaling and timing requirements for DDR3
- Understanding match length versus match delay
- Compensating for typical routing delay
- Using the iCD Stackup Planner to assist in delay matching calculation
In part 2, we will build upon this foundation by demonstrating the practical aspects of DDR3 layout techniques.
This latest webinar, Double Data Rate (DDR3) Shouldn't be Double Trouble, is scheduled for January 31, 2018 at 2 pm Eastern Time. For more information and to register, click HERE.
I-Connect007 Editorial Team
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
Andy Shaughnessy, PCBDesign007
I had the opportunity to talk with our contributor Doug Brooks recently. He has been doing some research on temperature effects on PCB traces over the last few years, and I wanted to check the status of his latest thermal efforts. He discussed his work with Dr. Johannes Adam, why temperature charts based on a trace in isolation are inaccurate, and how the industry remained so wrong about PCB temperatures for so long.
Pete Starkey, I-Connect007
European Editor Pete Starkey and Ucamco Managing Director Karel Tavernier discuss Ucamco’s cloud-based Communic8tor platform which facilitates two-way communication between the CAM engineer and the PCB designer, or any other party involved in the manufacturing process. This gives real-time access to image data and annotations, enabling queries to be resolved, changes to be approved, and a full communications history to be maintained.