IEEE’s Romanian SIITME Show a Success


Reading time ( words)

The 23rd annual IEEE International Symposium for Design and Technology in Electronic Packaging (SIITME) was held in Constanta, Romania, October 26-29, 2017. It attracted more than 190 participants from Romania, and 13 other counties. While there might be some who question the suitability of Romania as a venue for such a conference, the country has a long technological history and has produced some top innovators and pioneers in aviation including Aurel Vlaicu, Traian Vuia, Henri Coanda (who prototyped an early jet aircraft in 1910), and great engineers like Anghel Saligny, and George Constantinescu, a pioneering scientist credited with developing the theory of sonics.

The convention was created to bring together members of the electronic packaging community from near and far to discuss technology developments and needs. Ongoing efforts by the organizers have been intensified over the last decade in their effort to bring together academia and industry to share knowledge and experiences. The SIITME conference creates a shared environment where students, teachers, and senior researchers present their latest works and interact with industry representatives who highlight the state-of-the-art in the industry.

As Professor Dan Pitica of the Technical University of Cluj Napoca, Romania, observed, “SIITME is more than a just a conference. The Association for Promoting Electronics Technology, APTE, succeeded in bringing together eight top international professionals to give keynote talks including Klaus-Jurgen Wolter (Technische Universitat Dresden, Germany), Gheorghe Brezeanu (Politehnica University of Bucharest, Romania), Stefan Techau (ASM Assembly Systems GmbH & Co KG), Frederic Kratz (National Institut of Applied Sciences INSA, Centre Val de Loire, France), Joseph Fjelstad (Verdant Electronics, USA), Jose Sartori (OSRAM Opto Semiconductors), Etienne Sicard (INSA Toulouse, France), Radu Sporea (Advanced Technology Institute, University of Surrey, Guildford, UK), and many specialists from Continental Automotive, Tecnometal (Italy), ES Srl Electronic Solution (Italy), SEM Communication & GEST Labs SRL (Italy), Comtest, Miele Tehnica, NTT Data.”

To focus on the future, the first day of the event was dedicated to the Industrial Workshop “Advanced Interconnection and Disruptive Technologies, Debate for the Future Sustainable Electronics Packaging.” This event was moderated by industry representatives Cosmin Moisa, Continental Automotive Romania; Stefan Techau; Paul Svasta, University Politehnica of Bucharest; and myself. Topics included the reliability challenge for the electronic products, front-end assembly capability, managing PCB supplier challenges, and CETTI’s early steps in exploring Occam technology were also discussed.

To read this entire article, which appeared in the December 2017 issue of The PCB Design Magazine, click here.

Share


Suggested Items

Estonia a Hot Spot for New Technology

04/23/2018 | Andy Shaughnessy, Design007 Magazine
Most Westerners know very little about Estonia. A former Soviet Bloc country, Estonia has come a long way since restoring its independence in 1991. Electronics companies are thriving in this tiny EU member country, and capital city Tallinn has been called “Silicon Valley on the Baltic Sea.” During productronica, I met with Arno Kolk, general manager of the Estonian Electronics Industries Association, and we discussed the explosion of new technology in this “Baltic Tiger” country?

South African Electronics Industry Going Strong

04/03/2018 | Barry Matties, I-Connect007
EDA Technologies is a South African company that offers PCB design engineering services, mainly for the domestic electronics market, which makes up a surprising 12.5% of South Africa’s GDP. Barry Matties recently spoke to founder Nechan Naicker about the benefits of outsourcing to South Africa, the market segments they service there, and any advice he had to offer from his 20+ years in the industry.

Entering—and Enjoying—the Industry

02/13/2018 | Jonathan Zinski, I-Connect007
I was recently given the opportunity to write an article for our publication. Being somewhat new to this industry, I figured it would be a good idea to write an introduction on how I got into electronics—specifically the part most people my age don’t give thought to.



Copyright © 2018 I-Connect007. All rights reserved.