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Asia and South Pacific Design Automation Conference 2018 (ASP-DAC 2018) is the twenty-third annual international conference on VLSI design automation in Asia and South Pacific region which will be held on January 22-25, 2018 at Jeju, Korea. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances and with forums for future directions in technologies related to Electronic Design Automation (EDA).
As a specially recognized “Global Education Partner” by ACM SIGDA, Cadence will sponsor the Student Research Forum at the ASP-DAC, which is renovated from a poster session for students to present their dissertation research with experts, extended to offer a great opportunityies to establish contacts for their future career. In addition, it helps companies to know the latest research and discover talents for the employment. Please join us and you will get a chance to talk with Cadence R&D leaders face to face.
For more information, click here.
Andy Shaughnessy, I-Connect007
For our multi-board design issue, I interviewed Dave Wiens, product marketing manager for Mentor, a Siemens business. We discussed how the multi-board design technique differs from laying out single boards, along with the planning, simulation and analysis processes required to design multi-board systems.
Chang Fei Yee, Keysight Technologies
This article briefly introduces the 4-level pulse amplitude modulation (PAM-4) and its application in 400 Gigabit Ethernet (400GbE), to support the booming data traffic volume in conjunction with the deployment of 5G mobile communications. Furthermore, this article also highlights the essential pre-layout effort from signal integrity perspective for physical (PHY) link design on a PCB, including material selection, transmission line design and channel simulation to support 56Gbps data rate that paves the way for seamless communication in 400GbE.
Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.