Reading time ( words)
The December issue of The PCB Design Magazine has published and is now available.
Thermal Management: Sounding the Alarm
This month, Dr. Johannes Adam and the rest of our industry experts sound the alarm about the need for better thermal management in PCB design.
Read all about it this month in The PCB Design Magazine, now on the PCBDesign007 virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download the pdf version to your devices for future reference.
I-Connect007 Editorial Team
In this interview, Saline Lectronics (an Emerald EMS company) President Jason Sciberras talks about PCB designers offering packaging options in the bill of materials. As Jason explains, mil/aero manufacturers like Saline can’t make many changes to a design without getting recertified, so including approved packaging options in the BOM from the start is a great way to go. Are you offering options in your BOM?
Andy Shaughnessy, Design007
Design engineer Sathishkumar Vijayakumar (aka Sathish Kumar V.) with Tessolve Semiconductor, India, took home top honors in this year’s IPC Design Competition, besting the other four finalists in a rigid-flex design showdown during IPC APEX EXPO. Unlike last year, no one finished the design completely, so judges graded competitors on what they did finish, as well as criteria such as design decisions they made, and whether they followed electrical and DFM rules.
Zachariah Peterson, NWES
As I look back on 2022, I’m realizing that my company plays multiple roles in client projects beyond just designing circuits and PCBs. Sure, we’re primarily a PCB design company, but we also help with things that happen outside the PCB. This includes tasks like enclosure design, defining mechanical constraints, simulating electrical behavior, mating boards into larger assemblies, selecting cabling, and defining test requirements, all of which slowly creep into the standard scope of work for design projects.