Mentor Names 2017 FloTHERM Award Winners for Electronics Thermal Design Excellence


Reading time ( words)

Mentor, a Siemens business, today announced its winners for the inaugural annual FloTHERM ΔTJ Award for Excellence in Electronics Thermal Design. For over 30 years, the FloTHERM solution has been the de facto computational fluid dynamics (CFD) solution for electronics cooling. The FloTHERM product provides tight connectivity with electronic design automation (EDA) and mechanical design automation (MDA) development process flows, and is used to predict airflow, temperature, and heat transfer in components, boards, and complete systems.

FloTHERM ΔTJ Award winners were required to demonstrate an application using the FloTHERM technology (including FloTHERM XT, FloTHERM PCB or FloTHERM IC) to successfully address a design problem. This included a return on investment (ROI) improvement due to quantifiable use of CFD technology.

The first place award winner is the team from the Institute of Microelectronics (IME), Agency of Science, Technology and Research in Singapore. The team comprising Gong Yue Tang, Yong Han, Boon Long Lau, Xiaowu Zhang, and Daniel Min Woo Rhee, received a trophy for their paper, Development of a Compact and Efficient Liquid Cooling System with Silicon Micro-cooler for High-Power Microelectronic Devices. The team also received a $1,000 (USD) Amazon gift card, which they have donated to the Singapore Children’s Society.

“Microchannel based liquid cooling and thermal management technology has been used to develop the compact and efficient cooling system for high power electronics systems,” stated Gong Yue Tang. “Through the thermal modelling and simulations, FloTHERM has been demonstrated as a fast and cost-effective thermal design tool to evaluate and optimize the thermal performance of the liquid cooling system proposed in this study.”

mentor_award2.jpg

Two runners-up were also selected. Hugo Ljunggren Falk, KTH School of Industrial Engineering and Management in Sweden received a $500 (USD) Amazon.de gift card for his paper, Thermal Management in an IR-Camera. And Gabriel Ciobanu from Continental Corporation in Romania also received the same for his paper, co-written with Boris Marovic from Mentor, entitled The Fundamentals of Improving PCB Thermal Design.

“Used by thousands of engineers across the globe, FloTHERM is the award-winning CFD electronics cooling solution used by the world’s leading companies,” said Roland Feldhinkel, general manager of the Mentor Mechanical Analysis Division. “This is our inaugural FloTHERM Award competition and we are honored by the broad range of successful applications we received. Congratulations to our 2017 winners, and we look forward to next year’s competition.”

For more information on the FloTHERM 2017 award winners, click here.

About Mentor, a Siemens business

Mentor, a Siemens business, is a world leader in electronic hardware and software design solutions, providing products, consulting services, and award-winning support for the world’s most successful electronic, semiconductor, and systems companies. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. 

Share


Suggested Items

PCB Cooling Strategies, Part 1

01/17/2018 | Bin Zhou, EDADOC
With the development of communication and IT industries and the ever-increasing demand for information analysis, many chip makers have racked their brains trying to provide customers with better technology, such as increased computing power and storage capacity of chips as well as diversifying their product offerings.

Streamlining Thermal Design of PCBs

01/10/2018 | Dr. John Parry, CEng, Mentor
When designing a PCB, thermal issues are often locked in at the point of selecting and laying out the chip package for the board. After that, only remedial actions are possible if the components are running too hot. Assumptions made about the uniformity of the airflow in these early design stages can mean a disaster for the commercial viability of a PCB if those assumptions are incorrect. A different approach is needed to improve reliability and to optimize board performance. Dr. John Parry of Mentor explains.

Mike Jouppi Discusses his Drive for Better Thermal Data

01/12/2018 | Andy Shaughnessy, PCB Design007
If you mention thermal management in a group of PCB designers and design engineers, Mike Jouppi’s name usually pops up. Mike is an engineer and founder of the Thermal Management LLC consulting firm. He spent years updating IPC’s charts on current-carrying capacity, which had been unchanged since the 1950s. I recently caught up with Mike and asked him to give us his views on the state of thermal management, as well as the tools and standards related to thermal design.



Copyright © 2018 I-Connect007. All rights reserved.