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Challenges of Heat Removal from Flex Circuit Technology
December 14, 2006 |Estimated reading time: Less than a minute
Removing the heat from chip scale packaging implemented on flexible circuits presents a challenge. Heat generation is a certainty for all ICs and especially with high-performance logic ICs. This article explores the traditional methods and design options available to manage the thermal load on whatever materials are selected. How do convection, conduction and radiative processes play out with CSP and flex circuits? The most popular flex circuit substrate materials are polyimide and polyester, that by themselves are not good thermal conductors but rather are thermal insulators. Consequently, the job of heat conduction falls on the metallic conductors. Just as in rigid printed circuits it will be necessary to install the equivalent of thermal vias for a given level of power dissipation. This article also gives parameters for the thermal problem of flex circuits with point heat sources.Download this PDF White Paper to learn more.This article originally appeared in at the IPC Flex and Chips Convention 2006 and is republished here with permission.