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Creating library content can be simple with the right tools. CAD vendors can only supply so much content. At some point, you have to create a symbol or footprint. Don’t use the manual processes provided. This one-hour webinar will show you how to use automation tools included with PADS to create the parts you need quickly and simply.
Finding those parts to place on a design can be tedious. You’ll learn how to simplify this process using parametric searching.
The webinar will take place on November 9, 2017, at 9:30 am Pacific. The presenter is Brent Klingforth,
Attendees will learn:
- Tool automation to help make custom symbols
- Wizard based footprint creation using IPC compliant rules
- Manage component property information the easy way
- Library content and data available for free
To register, or for more information, click here.
I-Connect007's Happy Holden reviewed the recently concluded IPC APEX EXPO 2018. Among the highlights: Less than 10% of all new orders arrive at the PCB fabricator’s facility with complete, accurate design data. Most have missing or incorrect data.
I-Connect007 Editorial Team
During the Design Forum at IPC APEX EXPO 2018, Jan Pedersen, senior technical advisor for the PCB broker Elmatica, gave a presentation on CircuitData. The language is designed to help facilitate other design data transfer formats such as Gerber, ODB++, and IPC-2581. Jan spoke with Managing Editor Andy Shaughnessy and Contributing Technical Editor Happy Holden about how this open language works with the existing data formats, as well as the need to eliminate paper documents from design process, and how the industry can help shape this open-source language.
Andy Shaughnessy, Design007 Magazine
During DesignCon 2018, Andy Shaughnessy sat down for an interview with Martin Cotton, director of OEM projects for Ventec. Martin was a PCB designer for years, so he has experience on both sides of the desk. They discussed Ventec’s reasons for coming to DesignCon, their expansion into low-loss materials, and Ventec’s new I-Connect007 book, The Printed Circuit Designer’s Guide to Thermal Management with Insulated Metal Substrates.