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Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, will present a paper on Advanced IMS Material Solutions at the Advancements in Thermal Management Conference from 9-10 August 2017 in Denver, Colorado, USA.
Martin Cotton, Ventec’s Director of OEM Technology will be presenting his technical paper entitled ‘Advanced Thermal Material Solutions’ on Wednesday, 9 August at 11am at the DoubleTree by Hilton Denver Tech Center.
Thermal issues in printed circuit boards and their related assemblies are becoming as important as the signal integrity in the design and manufacture of PCBs. The relationship between the materials used and the thermal functionality is a key focus as industry sectors tackle issues of reliability, aging and functionality. Costs and the value analysis between thermal transfer rates and materials used are fast becoming a design discipline that has huge effects on final assembly cost and thermal functionality.
Martin’s presentation introduces new generation materials, their background and what current solutions are being used by various market sectors. Discussion on the next generation of insulated metal substrates (IMS) and prepregs for printed circuit boards and hybrid constructions will be covered. Design and the value analysis required to lower cost in the final assembly while maintaining thermal function will be reviewed. Finally, the myths and misunderstandings around thermal materials and how to use them will be explained.
Martin will be joined by Jack Pattie, President of Ventec USA.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the U.S. and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.