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IPC—The Association Connecting Electronics Industries will be holding a two-day, design-focused IPC professional development courses on July 26–27, 2017, in Chicago, Illinois.
Day 1 will focus on EMI control, including grounding, power distribution, and board stack-up, among others, and will be led by Rick Hartley. This workshop is all about up-front design. Getting the design right to prevent having to throw costly band-aids on the product to stop the hemorrhaging of electric and magnetic fields. The knowledge gained from this workshop can significantly reduce product development time and cost, as well as improve product performance.
The next day’s course will be on design challenges, including fine pitch BGA design, and best design practices to produce a more manufacturable board. To be given by Susy Webb, the first section of this two-in-one class utilizes illustrations and real-world examples to explore the complexities of using fine pitch BGAs in designs. The second section of this class discusses best practices that, when incorporated by the designer, will help make fabrication and assembly easier and therefore lower the time and cost needed for a quality board.
For more information, or to register for these courses, click here.
Dave Lackey and Anaya Vardya, American Standard Circuits
The design process is arguably the most important part of the flex circuit procurement process. The decisions made in the design process will have a lasting impact, for better or worse, throughout the manufacturing cycle. In advance of providing important details about the actual construction of the flex circuit, it is of value to provide some sort of understanding of the expected use environment for the finished product.
Ralf Bruening, Zuken
Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.
John Coonrod, Rogers Corporation
Ready or not, 5G is coming, and it will require the right circuit materials for many different types of high-frequency circuits, including power amplifiers. 5G represents the latest and greatest in wireless technology, and it will be challenging to design and fabricate, starting with the circuit board materials, because it will operate across many different frequencies, such as 6 GHz and below, as well as at millimeter-wave frequencies (typically 30 GHz and above).