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IPC—The Association Connecting Electronics Industries will be holding a two-day, design-focused IPC professional development courses on July 26–27, 2017, in Chicago, Illinois.
Day 1 will focus on EMI control, including grounding, power distribution, and board stack-up, among others, and will be led by Rick Hartley. This workshop is all about up-front design. Getting the design right to prevent having to throw costly band-aids on the product to stop the hemorrhaging of electric and magnetic fields. The knowledge gained from this workshop can significantly reduce product development time and cost, as well as improve product performance.
The next day’s course will be on design challenges, including fine pitch BGA design, and best design practices to produce a more manufacturable board. To be given by Susy Webb, the first section of this two-in-one class utilizes illustrations and real-world examples to explore the complexities of using fine pitch BGAs in designs. The second section of this class discusses best practices that, when incorporated by the designer, will help make fabrication and assembly easier and therefore lower the time and cost needed for a quality board.
For more information, or to register for these courses, click here.
Bill Acito, Cadence Design Systems
The challenges faced by the PCB designers of today are significant. If we examine the breadth of designs, we find ever-increasing data rates and more high-speed signal routing that drive additional challenges meeting signal-quality requirements, including reflection signal loss and crosstalk issues. At the same time, designers are being asked to complete designs in shorter cycle times and in smaller form factors. They must come up with new and more complex routing strategies to better control impedance and crosstalk. Manual implementation is often time-consuming and prone to layout errors.
Dave Wiens, Mentor, a Siemens Business
PCB designers working with flex or rigid-flex technology face many potential risks that can derail a project and cause costly design failures. As the name implies, flex and rigid-flex designs comprise a combination of rigid and flexible board technologies made up of multiple layers of flexible circuit substrates, attached internally and/or externally to one or more rigid boards. These combinations provide flexibility for the PCB designer working on dense designs that require a specific form factor. Rigid-flex allows the PCB design team to cost-efficiently apply greater functionality to a smaller volume of space, while providing the mechanical stability required by most applications.
Andy Shaughnessy, Design007 Magazine
Millennials are the future of our industry. What does this mean for the PCB design community? How do we attract more of these smart young people to the world of PCB design? I asked Paul Musto, director of marketing for Mentor’s Board Systems Division, to explain the company’s initiatives aimed at drawing more young people into PCB design