April Issue of The PCB Design Magazine Available Now


Reading time ( words)

The April 2017 issue of The PCB Design Magazine is available now. This month, our expert contributors discuss the current state of high-speed materials, and the growth of low-loss laminates that pick up where FR-4 falls short. 

Choosing the right material for your PCB was so simple a few decades ago. But today, designers often must select an advanced low-loss PCB material with low Df and Dk values—hopefully one that isn’t prohibitively expensive or terribly difficult for fabricators to register during lamination.

So, this month, we feature interviews with a variety of experts on advanced materials. Summit Interconnect’s Gerry Partida and All Flex Flexible Circuits’ Joe Menning spoke with our editorial team about the state of advanced materials from the fabricators’ viewpoint. Craig Davidson of TTM explains the company’s pursuit of embedded optical interconnect and the challenges surrounding optical PCBs. Bruce Mahler of Ohmega Technologies examines Ohmega’s resistive material technology and some of the drivers and issues in that segment of the industry. And APCT’s Steve Robinson discusses his company’s focus on working with PCB designers and engineers to create advanced, high-speed PCBs. Plus, columnist John Coonrod of Rogers Corporation discusses some of the challenges and remedies for woven glass weave effect.

We also have columns by our contributors Barry Olney of In-Circuit Design, and Alistair Little of Electrolube, as well as an interview with Lawrence Romine of Altium and an article about the TIE PCB design conference in Romania, coming up April 25-27.

Read the April issue of The PCB Design Magazine, now on the virtual newsstand and available for delivery in your e-mail inbox by subscribing here or by registering for myIConnect007 where you can manage all your subscriptions and gain instant access to our eBook library.

Share


Suggested Items

Achieving Optimum Signal Integrity During Layer Transition on High-Speed PCBs

07/11/2018 | Chang Fei Yee, Keysight Technologies
In electronic systems, signal transmission exists in a closed-loop form. The forward current propagates from transmitter to receiver through the signal trace. Meanwhile, the return current travels backward from receiver to transmitter through the power or ground plane directly underneath the signal trace that serves as the reference or return path. The path of forward current and return current forms a loop inductance. It is important to route the high-speed signal on a continuous reference plane so that the return current can propagate on the desired path beneath the signal trace.

Faster Board Speeds Demand Constraint-Driven Design

06/19/2018 | Ralf Bruening, Zuken
Using powerful constraint techniques can be a double-edged sword. While the design process is made much safer by including constraints, it is all too easy to over-constrain the design and make it impossible to complete routing and placement. Even paper design guidelines can make products uneconomic to produce unless a great deal of engineering knowledge is applied during the design.

Experts Discussion: What Does 5G Mean to Materials and EDA Tools?

06/06/2018 | Andy Shaughnessy, Design007 Magazine
Whether we’re ready for it or not, 5G technology is coming. We decided to speak with John Hendricks, market segment manager for wireless infrastructure at Rogers Corporation, and Ben Jordan, director of product and persona marketing for Altium, about the challenges related to 5G and what this means for PCB designers and fabricators.



Copyright © 2018 I-Connect007. All rights reserved.