-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueOpportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
Manufacturing Know-how
For this issue, we asked our expert contributors to share their thoughts on the absolute “must-know” aspects of fab, assembly and test that all designers should understand. In the end, we’re all in this together.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
February 22, 2017 | Real Time with...IPCEstimated reading time: Less than a minute
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTime with… IPC APEX EXPO video interviews, aimed down the main aisle.
The time-lapse is made up of more than 50,000 photos and separated by each day. We are sure you will find this very entertaining. The video is about seven minutes in length…which is not bad considering you’re watching a three-day event!
Suggested Items
ASMPT to Exhibit Smart Manufacturing at IPC APEX EXPO 2024
03/27/2024 | ASMPTWith its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.
Mycronic to Showcase More Versatile, High-productivity Assembly Solutions at IPC APEX EXPO 2024
03/27/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.
TRI Launches New Advanced Packaging 3D CT AXI Solution
03/26/2024 | TRITest Research, Inc. (TRI) proudly announces the launch of the SEMI 3D CT AXI solution, TR7600F3D SII Plus, marking a paradigm shift in precision and reliability for high-reliability electronics manufacturing, such as the Advanced Packaging Industry.
Blackfox Ready for IPC APEX EXPO 2024
03/26/2024 | Andy Shaughnessy, I-Connect007Blackfox Training Institute offers IPC-certified training for a myriad of PCB assembly techniques and standard certifications. With many technologists beginning to eye retirement, this training is at a premium. I recently spoke with Jamie Noland, director of training and education for Blackfox, about the company’s latest educational efforts, and his plans for the upcoming IPC APEX EXPO, where Blackfox will be exhibiting.
iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs
03/25/2024 | IPCToday’s system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.