Real Time with...IPC: Jim Fuller Offers HDPUG Update


Reading time ( words)

Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity

To watch this interview, click here.

Share

Print


Suggested Items

Insulectro Works to Bridge the Fabricator/Designer Gap

12/19/2019 | Barry Matties, I-Connect007
Barry Matties sat down with Insulectro’s Megan Teta and Mike Creeden to discuss trends they see in the materials market and how they’re working to bridge the gap between fabrication and design, including helping designers understand what they can do to make a board more manufacturable.

Designing for Complex PCBs

12/12/2019 | I-Connect007 Editorial Team
The I-Connect007 editorial team sat down with Freedom CAD’s Scott Miller to talk about the industry’s demand for more increasingly complex PCBs, and the challenges this presents. They also discuss Freedom CAD’s in-house training programs, the company’s recent book authored by Scott, and why communication is such an important tool in a PCB designer’s toolbox.

AltiumLive Frankfurt 2019: Happy Holden Keynote

12/12/2019 | Pete Starkey, I-Connect007
Nobody left early! Altium had wisely kept Happy Holden’s keynote presentation on “PCB Trends that Will Impact Your Future” until the end of the final day of the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey presents the highlights of Happy's presentation.



Copyright © 2020 I-Connect007. All rights reserved.