Real Time with...IPC: Jim Fuller Offers HDPUG Update


Reading time ( words)

Sanmina's Jim Fuller gives his insight on how the High-Density Packaging User Group (HDPUG) shares the experience and resources of member companies to tackle projects and get results. Also, he reviews the study of the effect of copper bonding treatment on signal integrity

To watch this interview, click here.

Share


Suggested Items

Lee Ritchey On the Future of PCB Design

12/11/2017 | Barry Matties, Publisher, I-Connect007
I spoke with long-time PCB design instructor and Right the First Time author Lee Ritchey during the recent AltiumLive event in Germany. Lee and I discussed everything from the advice he offers to young PCB designers to his thoughts on where the industry is going and what’s missing from today’s electrical engineering curriculum.

Who Really Owns the PCB Layout?

12/13/2017 | Paul Taubman, Nine Dot Connects
In order to understand the current climate, we have to look at the division of labor that took place in electronic design about 40 years ago. The labor was divided into two processes, with the first being the design itself. This process was (and still is) owned by the electrical engineers. Though circuit design has changed, the methods for representing the circuit have not. Paul Taubman of Nine Dot Connects explains.

Cannonballs, eBooks, and Signal Integrity

12/04/2017 | Andy Shaughnessy and Pete Starkey, I-Connect007
I-Connect007 editors Andy Shaughnessy and Pete Starkey recently met with Polar Instruments Managing Director Martyn Gaudion at productronica. They discussed the success of "The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs," the ongoing challenge of facilitating communication between designers and fabricators, and the influence of chemical bond-enhancement processes on insertion loss.



Copyright © 2017 I-Connect007. All rights reserved.