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Simberian Inc. will present and exhibit at the DesignCon 2017 conference and exhibition, January 31 – February 2 at the Santa Clara Convention Center. Simberian will be presenting Simbeor THz electromagnetic signal integrity software updated with multiple features and accelerated with the cost-effective distributed grid computing. Simberian’s technology is recognized at DesignCon 2017 with nominations for two prestigious industry awards.
Simberian, an industry leader in electromagnetic simulation technology, will demonstrate updated Simbeor THz electromagnetic signal integrity software at booth #527 at DesignCon 2017. Two electromagnetic solvers in the updated Simbeor THz are accelerated with parallelization on a loosely coupled grid of computers available in an internal, worldwide or cloud networks. Users of Simbeor THz can now reduce time for design of non-reflective transitions, such as viaholes for serial links, by using loosely coupled computing resources distributed within a company or in a cloud. Setting up the distributed computing environment in Simbeor THz takes just a few minutes and the parallelization is completely automated. The distributed computing option further strengthens Simbeor #1 position in the electromagnetic SI software price-performance category. Simbeor THz also remains the only tool on the market with the accuracy of analysis formally and independently validated for PCB interconnects operating up to 32 Gbps or 64 GBd. Simbeor THz is available for customers and trials at www.simberian.com.
Simberian’s technology and achievements are recognized at DesignCon 2017 with two nominations for the prestigious industry awards. Paper "Cost-effective PCB Material Characterization for High-volume Production Monitoring", co-authored by HPE and Simberian, has been chosen by Technical Program Committee as a finalist for the DesignCon 2017 Best Paper Award. Simberian’s founder Yuriy Shlepnev has been also selected by SI community as a finalist for the DesignCon Engineer of the Year Award.
DesignCon is the world's premier conference for chip, board, and systems design engineers in the high-speed communications and semiconductor communities. DesignCon, created by engineers for engineers, takes place annually in Silicon Valley and remains the largest gathering of chip, board, and systems designers in the country. This three-day technical conference and expo combines technical paper sessions, tutorials, industry panels, product demos and exhibits from the industry's leading experts and solutions providers. More information is available at: designcon.com.