-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil
January 13, 2017 | Advanced Copper FoilEstimated reading time: 1 minute
Advanced Copper Foil has secured an international patent for Poly-Supported Copper Foil, promoted under the name ACF-Screen. This patent is non-Provisional under International Application number PCT/050938.
ACF-Screen is comprised of a proprietary protective Poly Release film, which is adhered to sheets of ultra-thin copper foil in a cleanroom environment. This product provides complete protection of the copper surface throughout the entire cycle of PCB layup and lamination. ACF-Screen utilizes an inert adhesive which results in a guaranteed residue-free copper surface during subsequent processing. The release film will withstand temperatures of the lamination cycle, allowing for easy removal during break-down. ACF-Screen will eliminate anomalies caused by bending or creasing of copper foils during handling, while always completely protecting the surface from foreign materials and contamination. This product is available on copper foils from 5 µm, 9 µm to 70 µm. ACF-Screen is available on Standard, VLP, HVLP and ANP (Almost No Profile) copper foils.
“This product is going to revolutionize the industry. It will ease the handling of copper foils compared to loose foils, resulting in more efficient and speedier layup process,” says Shane Stewart, Product Manager.
ACF will be showcasing this product at the IPC APEX show in San Diego on February 14-16. Drop by the booth (#3701) for more information and to request samples of this new revolutionary product.
About Advanced Copper Foil
Advanced Copper Foil is a company dedicated to High Performance Copper Foils and their applications in the Printed Circuit and Battery Shielding Industries. Advanced Copper Foil is committed to providing PCB Fabricators, Laminate Manufacturers and Battery Shielding Companies with a cost-effective alternative to the traditional products on the market today. For further information visit: www.advancedcopperfoil.com
Suggested Items
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources: