2015’s Most Read PCB Articles
December 31, 2015 | I-Connect007Estimated reading time: 2 minutes
Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. that is why 22 IPC member-company executives descended on the nation’s capital for IMpact 2015: Ipc on capitol hill, IPC’s annual advocacy event.
A Cautionary Tale: Counterfeit Materials
John Ling of EIPC writes, “Risk from counterfeits wears many hats. There is reputational risk, which can be damaging; there is inherent safety risk, which could be fatal; and there is financial risk to the OEM, the PCB manufacturer, and the PCB broker. One way of minimizing risk is by dealing direct.”
Institute of Circuit Technology 41st Annual Symposium
ICT technical director Bill Wilkie has always excelled in locating interesting and unusual venues for the Institute of circuit technology annual Symposium, and this year was no exception. For the 2015 event, the 41st, he chose the Black Country Living Museum, an open-air museum of rebuilt historic buildings in the home of the original Industrial Revolution.
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