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NextFlex Convenes the Hybrid Electronics Community at Binghamton University

05/01/2024 | NextFlex
Binghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking. 

NextFlex Announces 2024 Fellows Awards for Five Outstanding Recipients

03/29/2024 | BUSINESS WIRE
NextFlex, America's Hybrid Electronics Manufacturing Institute, presented the annual NextFlex Fellow Awards to five deserving individuals in recognition of their exceptional commitment to advanced manufacturing and the additive hybrid electronics member community.

NextFlex Announces $5M Education Fundraising Effort: First Spotlight - Transforming the Landscape for Women in Technology

03/27/2024 | BUSINESS WIRE
NextFlex Learning Programs, the education-focused arm of the NextFlex® Hybrid Electronics Manufacturing Innovation Institute, announces its first spotlight effort, “NextFlex Supports Women in STEM” to increase the number of women in STEM fields, which could accelerate U.S. GDP growth by boosting women’s cumulative earnings by $299B and adding $5.9T to the global stock market within 10 years according to S&P Global.

NextFlex Launches $4.4M Hybrid Electronics Funding Opportunity

03/22/2023 | Business Wire
NextFlex, America’s Flexible Hybrid Electronics (FHE) Manufacturing Institute, released Project Call 8.0 (PC 8.0), the latest call for proposals that seek to fund projects that further the development and adoption of FHE while addressing key challenges in advanced manufacturing that support Department of Defense priorities.

Universal Partners with NextFlex to Deliver Advanced Packaging Technology to Binghamton University

04/14/2022 | Universal Instruments
Universal Instruments held a ribbon-cutting ceremony for Binghamton University’s acceptance of the company’s High-Speed Wafer Feeder (HSWF) on April 5 at Universal’s corporate headquarters in Conklin, NY.
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