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Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

04/25/2024 | PRNewswire
Ansys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.

ROHM Group Company SiCrystal and STMicroelectronics Expand Silicon Carbide Wafer Supply Agreement

04/23/2024 | ROHM
ROHM and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the expansion of the existing multi-year, long-term 150mm silicon carbide (SiC) substrate wafers supply agreement with SiCrystal, a ROHM group company.

AST SpaceMobile ASIC Chip Enters Tape-Out Phase in Collaboration with TSMC

03/28/2024 | BUSINESS WIRE
AST SpaceMobile, Inc., the company building the first and only space-based cellular broadband network accessible directly by everyday smartphones designed for both commercial and government use, proudly announces the commencement of the tape-out phase for its Application-Specific Integrated Circuit (ASIC), in collaboration with TSMC, the world's leading foundry.

Cadence to Acquire BETA CAE, Expanding into Structural Analysis

03/06/2024 | Cadence Design Systems
Cadence Design Systems, Inc. announced it has entered into a definitive agreement to acquire BETA CAE Systems International AG, a leading system analysis platform provider of multi-domain, engineering simulation solutions.

Spirit Electronics Supports Disrupted ASIC Programs Amidst Foundry Consolidations

03/06/2024 | Spirit Electronics
Spirit Electronics, a distributor and outsourced semiconductor assembly and test (OSAT) provider, offers support for Application-Specific Integrated Circuits (ASICs) with full screen and qualification for military and space applications.
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