Intel, Google Cloud Optimize Performance for HPC Workloads
July 7, 2022 | IntelEstimated reading time: 2 minutes
Intel and Google are working together to drive high performance computing (HPC) forward on Google Cloud with the release of the Cloud HPC Toolkit. This new resource provides access to tools from the Intel® oneAPI Base and HPC Toolkits to optimize performance through Intel® Select Solutions for Simulations & Modeling. These new tools improve compile times, speed of results and offer multi-vendor acceleration in SYCL.
“Using Cloud HPC Toolkit with an Intel Select Solutions for Simulations & Modeling blueprint brings the added benefit of automatically spinning up a hardware-software configuration that has been rigorously tested and optimized for real-world performance, eliminating guesswork,” says Ilias Katsardis, HPC solution lead, Google.
Intel supports an open ecosystem to further industrywide innovation. Enterprises and research organizations are eager to adopt cloud computing to expand computing capacity and access the latest technologies for large, complex projects. Despite the desire to set up robust HPC environments in the cloud, many face challenges with overcoming unfamiliar concepts and tools. As a result, demanding workloads and applications are slow to deploy, encounter software incompatibilities and showcase subpar performance.
Intel Select Solutions for Simulations & Modeling also provides access to tools including the Intel® MPI Library and Intel® oneAPI Math Kernel Library via the Spack package manager, a popular software delivery and build platform. The culmination of work between Intel and Google helps make HPC more seamless and turnkey for users in this community.
The integrated Intel oneAPI tools support the open standards HPC developers need including C++, SYCL, Fortran, OpenMP, MPI and Python. They deliver productive cross-architecture performance across CPUs and GPUs using a single codebase.
The Cloud HPC Toolkit with Intel Select Solutions was developed using 2nd Gen Intel® Xeon® Scalable processors. It enables users to simplify configuration and deployment of HPC workloads and optimize for real-world performance. Intel’s ongoing collaboration with Google supports these projects, delivering more automated, user-friendly and compatible solutions that enable users to quickly meet increasing performance demands.
In August 2021, Intel announced a collaboration with Google that utilized Google’s HPC VM image and the Intel Select Solutions for Simulation & Modeling specification to automate the creation of Intel Select Solution-compliant HPC clusters on Google Cloud. Prior to that, Google worked with Intel to extend the capabilities of its CentOS-based VM image for HPC with the Intel HPC Platform specification, which made Intel’s software optimizations for Intel Xeon Scalable processors easily available to user applications running on Google Cloud.
Intel is extending open programming solutions into cloud environments to help drive innovation across the industry and adoption of new HPC CPU and GPU architectures as they become available. As demand for high-performance storage grows in HPC, so does the need for Distributed Asynchronous Object Storage (DAOS). As the foundation of the Intel exascale storage stack, DAOS is an open source software-defined scale-out object store that provides high-bandwidth, low-latency and high I/O operations per second storage containers to HPC applications. With this announcement, capabilities for DAOS are now hosted in the Cloud HPC Toolkit for a fully automated user experience.
Suggested Items
SCHMID Group Closes Business Combination, Begins Trading on NASDAQ
05/02/2024 | SCHMID GroupGebr. SCHMID GmbH, a global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, and Pegasus Digital Mobility Acquisition Corp. announced the completion of their business combination.
Real Time with… IPC APEX EXPO 2024: Sigma Engineering's Recycling and Regeneration Systems for PCB Etching
05/02/2024 | Real Time with...IPC APEX EXPOEvan Howard of Schmoll America interviews Kristoffer Bjorklund, Sigma Engineering's supply chain manager. We learn about Sigma's recycling and regeneration systems for PCB industry etching and the benefits and challenges of implementing these systems in existing factories.
Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
Real Time with… IPC APEX EXPO 2024: The Latest Advancements in Dry Storage
04/30/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Super Dry Totech's Jordan Mandel discuss the latest developments in dry storage solutions, the J standard, and the ongoing challenge of moisture management while highlighting the industry's shift toward smart solutions and the importance of seeking expert help for moisture mitigation.
Keysight Secures New Test Case Validations for Narrowband Non-Terrestrial Networks Standard
04/30/2024 | Keysight TechnologiesKeysight Technologies, Inc. has validated new conformance test cases for 3rd Generation Partnership Project (3GPP) Release 17 (Rel-17) standards for non-terrestrial networks (NTN) using narrowband internet of things (NB-IoT) technology.